The system will be going down for regular maintenance. Please save your work and logout.
Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)
Language
en
Article de revue
This item was published in
Microelectronics Reliability. 1998-06, vol. 38, n° 6-8, p. 1341-1345
Elsevier
English Abstract
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed ...Read more >
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices.Read less <
Origin
Hal imported