Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)
Idioma
en
Article de revue
Este ítem está publicado en
Microelectronics Reliability. 1998-06, vol. 38, n° 6-8, p. 1341-1345
Elsevier
Resumen en inglés
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed ...Leer más >