Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)
| hal.structure.identifier | Laboratoire d'Optique Appliquée [FYAM] | |
| dc.contributor.author | NASSIM, K. | |
| hal.structure.identifier | Laboratoire d'Optique Appliquée [FYAM] | |
| dc.contributor.author | JOANNES, L. | |
| hal.structure.identifier | Laboratoire d'Optique Appliquée [FYAM] | |
| dc.contributor.author | CORNET, A. | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | DILHAIRE, S. | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | SCHAUB, Emmanuel | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | CLAEYS, W. | |
| dc.date.issued | 1998-06 | |
| dc.identifier.issn | 0026-2714 | |
| dc.description.abstractEn | We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices. | |
| dc.language.iso | en | |
| dc.publisher | Elsevier | |
| dc.title.en | Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI) | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1016/s0026-2714(98)00079-1 | |
| dc.subject.hal | Physique [physics] | |
| bordeaux.journal | Microelectronics Reliability | |
| bordeaux.page | 1341-1345 | |
| bordeaux.volume | 38 | |
| bordeaux.issue | 6-8 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-01550250 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-01550250v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Microelectronics%20Reliability&rft.date=1998-06&rft.volume=38&rft.issue=6-8&rft.spage=1341-1345&rft.epage=1341-1345&rft.eissn=0026-2714&rft.issn=0026-2714&rft.au=NASSIM,%20K.&JOANNES,%20L.&CORNET,%20A.&DILHAIRE,%20S.&SCHAUB,%20Emmanuel&rft.genre=article |
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