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hal.structure.identifierLaboratoire d'Optique Appliquée [FYAM]
dc.contributor.authorNASSIM, K.
hal.structure.identifierLaboratoire d'Optique Appliquée [FYAM]
dc.contributor.authorJOANNES, L.
hal.structure.identifierLaboratoire d'Optique Appliquée [FYAM]
dc.contributor.authorCORNET, A.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, S.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorSCHAUB, Emmanuel
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorCLAEYS, W.
dc.date.issued1998-06
dc.identifier.issn0026-2714
dc.description.abstractEnWe present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices.
dc.language.isoen
dc.publisherElsevier
dc.title.enThermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)
dc.typeArticle de revue
dc.identifier.doi10.1016/s0026-2714(98)00079-1
dc.subject.halPhysique [physics]
bordeaux.journalMicroelectronics Reliability
bordeaux.page1341-1345
bordeaux.volume38
bordeaux.issue6-8
bordeaux.peerReviewedoui
hal.identifierhal-01550250
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01550250v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Microelectronics%20Reliability&rft.date=1998-06&rft.volume=38&rft.issue=6-8&rft.spage=1341-1345&rft.epage=1341-1345&rft.eissn=0026-2714&rft.issn=0026-2714&rft.au=NASSIM,%20K.&JOANNES,%20L.&CORNET,%20A.&DILHAIRE,%20S.&SCHAUB,%20Emmanuel&rft.genre=article


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