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Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)
Langue
en
Article de revue
Ce document a été publié dans
Microelectronics Reliability. 1998-06, vol. 38, n° 6-8, p. 1341-1345
Elsevier
Résumé en anglais
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed ...Lire la suite >
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices.< Réduire
Origine
Importé de halUnités de recherche