Architectural optimisation for microelectronic packaging
Language
en
Article de revue
This item was published in
Applied Thermal Engineering. 2009-03-25, vol. 29, n° 11-12, p. 2391-2395
Elsevier
English Abstract
The aim of this paper is to provide a methodical approach for architectural optimization of power microelectronic devices. Because critical parameters of electronic devices are linked with reliability, architectural ...Read more >
The aim of this paper is to provide a methodical approach for architectural optimization of power microelectronic devices. Because critical parameters of electronic devices are linked with reliability, architectural optimisation, selection of the geometrical parameters of device and optimization of these parameters by iteration method associated by numerical analysis of reliability have to be achieved. In this way, this paper discusses about a methodical and numerical approach for the optimization of reliability in electronic devices, in particular the influence of geometrical parameters on the device reliability.Read less <
English Keywords
Physical Sciences
Origin
Hal imported