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Application of Picosecond Ultrasonics to Non-Destructive Defect Analysis in VLSI Circuits
(Microelectronics Reliability. vol. 1, pp. 1, 2003)Article de revue -
Study of thermomechanical properties of Si/SiGe superlattices using femtosecond transient thermoreflectance technique
(Applied Physics Letters. vol. 87, n° 10, pp. 103506 (1-3), 2005-09-05)Article de revue -
ElectroStatic Discharge fault localization by laser probing
(Microelectronics Reliability. vol. 45, n° 9-11, pp. 1482-1486, 2005-09)Article de revue -
Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging
(IEEE Electron Device Letters. vol. 26, n° 2, pp. 78-80, 2005-02)Article de revue -
Measurement of the thermomechanical strain of electronic devices by shearography
(Microelectronics Reliability. vol. 40, n° 8-10, pp. 1509-1514, 2000-08)Article de revue -
Laser Seebeck Effect Imaging (SEI) and Peltier Effect Imaging (PEI): complementary investigation methods
(Microelectronics Reliability. vol. 43, n° 9-11, pp. 1609-1613, 2003-09)Article de revue -
Laser probes for the thermal and thermomechanical characterisation of microelectronic devices
(Microelectronics Journal. vol. 32, n° 10-11, pp. 891-898, 2001-10)Article de revue -
Surface acoustic waves at the vacuum-thermoviscoelastic solid interface
(Ultrasonics. vol. 37, n° 10, pp. 677-680, 2000-07-01)Article de revue -
Thermal study of PN thermoelectric couple by laser induced Seebeck EMF measurement
(Superlattices and Microstructures. vol. 35, n° 3-6, pp. 375-387, 2004-03)Article de revue -
Calibration procedure for temperature measurements by thermoreflectance under high magnification conditions
(Applied Physics Letters. vol. 84, n° 5, pp. 822-824, 2004-02-02)Article de revue