Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging
Langue
en
Article de revue
Ce document a été publié dans
IEEE Electron Device Letters. 2005-02, vol. 26, n° 2, p. 78-80
Institute of Electrical and Electronics Engineers
Résumé en anglais
We present in this letter a cost effective noncontact imaging technique well adapted to measure the temperature variations on microelectromechanical systems. The setup is tested on a microheater constituted of a polysilicon ...Lire la suite >