Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging
Idioma
en
Article de revue
Este ítem está publicado en
IEEE Electron Device Letters. 2005-02, vol. 26, n° 2, p. 78-80
Institute of Electrical and Electronics Engineers
Resumen en inglés
We present in this letter a cost effective noncontact imaging technique well adapted to measure the temperature variations on microelectromechanical systems. The setup is tested on a microheater constituted of a polysilicon ...Leer más >