Récemment ajouté

(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)

Communication dans un congrès avec actes

Modeling hydrolysis kinetics of dual phase α-Mg/LPSO alloys

LEGREE, Manuel

; BOBET, Jean-Louis

; MAUVY, Fabrice

...

(International Journal of Hydrogen Energy, 2022-06)

Article de revue

Far-Field Wireless Power Harvesting: Nonlinear Modeling, Rectenna Design, and Emerging Applications

GU, Xiaoqiang; HEMOUR, Simon

; WU, Ke

(Proceedings of the IEEE. vol. 110, n° 1, pp. 56-73, 2022-01)

Article de revue

Structural Odd–Even Effect Impacting the Dimensionality of Transport in BTBT‐CnOH Organic Field Effect Transistors

ROCHE, Gilles; BRUCKNER, Gudrun; DUMITRESCU, Dan ...

(Advanced Electronic Materials. pp. 2100265, 2021-09)

Article de revueLibre accès

Sub-millimeter-scale multijunction solar cells for concentrator photovoltaics (CPV)

DARNON, Maxime; DE LAFONTAINE, Mathieu; ALBERT, Pierre

...

(Proceedings Volume 11996, Physics, Simulation, and Photonic Engineering of Photovoltaic, SPIE OPTO, 2022, us, San Francisco, 2022-03-04)

Communication dans un congrès avec actes

Studying Three Families of Divergences to Compare Wide-Sense Stationary Gaussian Arma Processes

GRIVEL, Eric

(ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing, International Conference on Acoustics, Speech and Signal Processing (ICASSP), sg, Singapour, 2022-05)

Communication dans un congrès avec actes

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects

AYOUB, Bassel

; MOREAU, S.; LHOSTIS, S. ...

(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)

Communication dans un congrès avec actes

Global Thermal Modeling of Lung Heat Transfer with Blood Perfusion

DUHÉ, Jean-François; VICTOR, Stéphane

; MELCHIOR, Pierre ...

(Springer International Publishing, 2022-01)

Chapitre d'ouvrage

Initial Value Problem Should Not Be Associated to a Fractional Model Description Whatever the Derivative Definition Used

SABATIER, Jocelyn

; FARGES, Christophe

(Springer International Publishing, 2022-01)

Chapitre d'ouvrage

Increased Breakdown Voltage and robustness of Embedded power module

TABLATI, A.; ALAYLI, N.; ARABI, F. ...

(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)

Communication dans un congrès avec actes

Evaluation of SAC solder joint thermomechanical fatigue in different types of components

ROMDHANE, E. Ben; ROUMANILLE, P.; GUEDON-GRACIA, A. ...

(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)

Communication dans un congrès avec actes

Metal 3D printing for RF/microwave high-frequency parts

MARTÍN-IGLESIAS, P.; MARECHAL, M.; CALVES, P. ...

(CEAS Space Journal, 2022-05)

Article de revue

Epoxy Mold Compound Characterization for Modeling Packaging Reliability

TOMAS, Ariane

; LAMBERT, Benoit; FREMONT, Helene

...

(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)

Communication dans un congrès avec actes

Dynamics of the corrosion for SAC305 solder alloy in salt environment

AKODA, K.; GUEDON-GRACIA, A.; LEBRAUD, E. ...

(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)

Communication dans un congrès avec actes

ADP-based intelligent tracking algorithm for reentry vehicles subjected to model and state uncertainties

HU, Guanjie; GUO, Jianguo; GUO, Zongyi ...

(IEEE Transactions on Industrial Informatics. pp. 1-1, 2022)

Article de revue

IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218: Dépôts récents

Exploratory Analysis on Pixelwise Image Segmentation Metrics with an Application in Proximal Sensing ﻿

Supramolecular gating of TADF process in self-assembled nano-spheres for high-resolution OLED applications ﻿

Temperature-Dependent Structural Phase Transition in Rubrene Single Crystals: The Missing Piece from the Charge Mobility Puzzle? ﻿

A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices ﻿

Guaranteed state estimation using H ∞ interval approaches for space applications: a case study ﻿

2D Model for moisture diffusion in integrated Low-k dielectrics ﻿

Modeling hydrolysis kinetics of dual phase α-Mg/LPSO alloys ﻿

Far-Field Wireless Power Harvesting: Nonlinear Modeling, Rectenna Design, and Emerging Applications ﻿

Structural Odd–Even Effect Impacting the Dimensionality of Transport in BTBT‐CnOH Organic Field Effect Transistors ﻿

Sub-millimeter-scale multijunction solar cells for concentrator photovoltaics (CPV) ﻿

Studying Three Families of Divergences to Compare Wide-Sense Stationary Gaussian Arma Processes ﻿

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects ﻿

Global Thermal Modeling of Lung Heat Transfer with Blood Perfusion ﻿

Initial Value Problem Should Not Be Associated to a Fractional Model Description Whatever the Derivative Definition Used ﻿

Increased Breakdown Voltage and robustness of Embedded power module ﻿

Evaluation of SAC solder joint thermomechanical fatigue in different types of components ﻿

Metal 3D printing for RF/microwave high-frequency parts ﻿

Epoxy Mold Compound Characterization for Modeling Packaging Reliability ﻿

Dynamics of the corrosion for SAC305 solder alloy in salt environment ﻿

ADP-based intelligent tracking algorithm for reentry vehicles subjected to model and state uncertainties ﻿

Exploratory Analysis on Pixelwise Image Segmentation Metrics with an Application in Proximal Sensing

Supramolecular gating of TADF process in self-assembled nano-spheres for high-resolution OLED applications

Temperature-Dependent Structural Phase Transition in Rubrene Single Crystals: The Missing Piece from the Charge Mobility Puzzle?

A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices

Guaranteed state estimation using H ∞ interval approaches for space applications: a case study

2D Model for moisture diffusion in integrated Low-k dielectrics

Modeling hydrolysis kinetics of dual phase α-Mg/LPSO alloys

Far-Field Wireless Power Harvesting: Nonlinear Modeling, Rectenna Design, and Emerging Applications

Structural Odd–Even Effect Impacting the Dimensionality of Transport in BTBT‐CnOH Organic Field Effect Transistors

Sub-millimeter-scale multijunction solar cells for concentrator photovoltaics (CPV)

Studying Three Families of Divergences to Compare Wide-Sense Stationary Gaussian Arma Processes

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects

Global Thermal Modeling of Lung Heat Transfer with Blood Perfusion

Initial Value Problem Should Not Be Associated to a Fractional Model Description Whatever the Derivative Definition Used

Increased Breakdown Voltage and robustness of Embedded power module

Evaluation of SAC solder joint thermomechanical fatigue in different types of components

Metal 3D printing for RF/microwave high-frequency parts

Epoxy Mold Compound Characterization for Modeling Packaging Reliability

Dynamics of the corrosion for SAC305 solder alloy in salt environment

ADP-based intelligent tracking algorithm for reentry vehicles subjected to model and state uncertainties