Récemment ajouté

(2022 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), International Instrumentation and Measurement Technology Conference, ca, Ottawa, 2022-05-16)

Communication dans un congrès avec actes

QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms

BEN ROMDHANE, E.; ROUMANILLE, P.; GUEDON-GRACIA, Alexandrine ...

(2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 72nd Electronic Components and Technology Conference (ECTC), us, San Diego, 2022-05-01)

Communication dans un congrès avec actes

Thermal Modelling and Power Consumption Estimation of a Multi Floor Small Scale Building Using SPICE Simulator

DONDON, P.-H.; BULUCEA, C. A.

(WSEAS Transactions on Environment and Development. vol. 18, pp. 315-321, 2022-02-09)

Article de revueLibre accès

IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218: Dépôts récents

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