Recherche
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Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Satellite European School for Young Scientists Microscopy and Materials Characterization, Satellite European School for Young Scientists Microscopy and Materials Characterization, de, Dresde, 2022-10-12)Autre communication scientifique (congrès sans actes - poster - séminaire...)Libre accès -
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe
Communication dans un congrès -
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès -
Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack
Communication dans un congrès -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue -
Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs
Communication dans un congrès -
Volterra equations for fractional behaviors modeling with application to lithium-ion cells
(2022 American Control Conference (ACC), 2022 American Control Conference (ACC), Atlanta, GA, USA, 2022, us, Atlanta, 2022-09-05)Communication dans un congrès avec actes -
AFSIW Y-junction Circulator for High-power Handling New Space Applications
(2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, Denver, CO, USA, 2022, us, Denver, 2022-08-29)Communication dans un congrès avec actes