BiCMOS thermal sensor circuit for built-in test purposes
Langue
en
Article de revue
Ce document a été publié dans
Electronics Letters. 1998-01-25, vol. 34, n° 13, p. 1307-1309
IET
Résumé en anglais
New difficulties have arisen in integrated circuit (IC) testing due to trends in technological development. Alternatives to traditional circuit testing techniques are appearing, such as thermal testing. The authors present ...Lire la suite >
New difficulties have arisen in integrated circuit (IC) testing due to trends in technological development. Alternatives to traditional circuit testing techniques are appearing, such as thermal testing. The authors present a new built-in IC-surface differential thermal sensor. The sensor, analysis, implementation on a BiCMOS specific integrated circuit, and experimental measurements show the viability of temperature sensing for testing purposes.< Réduire
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