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hal.structure.identifierDepartment of Electronic Engineering
dc.contributor.authorALTET, J.
hal.structure.identifierDepartment of Electronic Engineering
dc.contributor.authorRUBIO, A.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, S.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorSCHAUB, Emmanuel
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorCLAEYS, W.
dc.date.issued1998-01-25
dc.identifier.issn0013-5194
dc.description.abstractEnNew difficulties have arisen in integrated circuit (IC) testing due to trends in technological development. Alternatives to traditional circuit testing techniques are appearing, such as thermal testing. The authors present a new built-in IC-surface differential thermal sensor. The sensor, analysis, implementation on a BiCMOS specific integrated circuit, and experimental measurements show the viability of temperature sensing for testing purposes.
dc.language.isoen
dc.publisherIET
dc.title.enBiCMOS thermal sensor circuit for built-in test purposes
dc.typeArticle de revue
dc.identifier.doi10.1049/el:19980947
dc.subject.halPhysique [physics]
bordeaux.journalElectronics Letters
bordeaux.page1307-1309
bordeaux.volume34
bordeaux.issue13
bordeaux.peerReviewedoui
hal.identifierhal-01550270
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01550270v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Electronics%20Letters&rft.date=1998-01-25&rft.volume=34&rft.issue=13&rft.spage=1307-1309&rft.epage=1307-1309&rft.eissn=0013-5194&rft.issn=0013-5194&rft.au=ALTET,%20J.&RUBIO,%20A.&DILHAIRE,%20S.&SCHAUB,%20Emmanuel&CLAEYS,%20W.&rft.genre=article


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