Thermal characterization of diamond films through modulated photothermal radiometry.
Language
en
Article de revue
This item was published in
ACS Applied Materials & Interfaces. 2014-02-12, vol. 6, n° 3, p. 2095-2102
Washington, D.C. : American Chemical Society
English Abstract
Diamond (Dia) films are promising heat-dissipative materials for electronic packages because they combine high thermal conductivity with high electrical resistivity. However, precise knowledge of the thermal properties of ...Read more >
Diamond (Dia) films are promising heat-dissipative materials for electronic packages because they combine high thermal conductivity with high electrical resistivity. However, precise knowledge of the thermal properties of the diamond films is crucial to their potential application as passive thermal management substrates in electronics. In this study, modulated photothermal radiometry in a front-face configuration was employed to thermally characterize polycrystalline diamond films deposited onto silicon (Si) substrates through laser-assisted combustion synthesis. The intrinsic thermal conductivity of diamond films and the thermal boundary resistance at the interface between the diamond film and the Si substrate were investigated. The results enlighten the correlation between the deposition process, film purity, film transverse thermal conductivity, and interface thermal resistance.Read less <
English Keywords
Diamond films
Laser-assisted combustion synthesis
Interface
Heat conduction
Origin
Hal imported