Thermal characterization of diamond films through modulated photothermal radiometry.
Langue
en
Article de revue
Ce document a été publié dans
ACS Applied Materials & Interfaces. 2014-02-12, vol. 6, n° 3, p. 2095-2102
Washington, D.C. : American Chemical Society
Résumé en anglais
Diamond (Dia) films are promising heat-dissipative materials for electronic packages because they combine high thermal conductivity with high electrical resistivity. However, precise knowledge of the thermal properties of ...Lire la suite >
Mots clés en anglais
Diamond films
Laser-assisted combustion synthesis
Interface
Heat conduction