Interfacial and surface characterization of fluorine treated SnAgCu and NiTi powders and NiTi/SnAgCu composite materials
Idioma
en
Article de revue
Este ítem está publicado en
Materials Science Forum. 2007, vol. 534-536, p. 1461-1464
Trans Tech Publications Inc.
Resumen en inglés
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder in order to improve the mechanical performances of solder paste.
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder in order to improve the mechanical performances of solder paste.< Leer menos
Palabras clave en inglés
Nickel
Titanium
Shape memory alloy
Fluorine treatment
Wetting property
Interface
Silver
Tin
Orígen
Importado de HalCentros de investigación