Interfacial and surface characterization of fluorine treated SnAgCu and NiTi powders and NiTi/SnAgCu composite materials
hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
dc.contributor.author | SILVAIN, Jean-François | |
hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
dc.contributor.author | BINOT, C. | |
hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
dc.contributor.author | DURAND, Etienne | |
hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
dc.contributor.author | DEMOURGUES, Alain | |
dc.date.issued | 2007 | |
dc.identifier.issn | 0255-5476 | |
dc.description.abstractEn | NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder in order to improve the mechanical performances of solder paste. | |
dc.language.iso | en | |
dc.publisher | Trans Tech Publications Inc. | |
dc.subject.en | Nickel | |
dc.subject.en | Titanium | |
dc.subject.en | Shape memory alloy | |
dc.subject.en | Fluorine treatment | |
dc.subject.en | Wetting property | |
dc.subject.en | Interface | |
dc.subject.en | Silver | |
dc.subject.en | Tin | |
dc.title.en | Interfacial and surface characterization of fluorine treated SnAgCu and NiTi powders and NiTi/SnAgCu composite materials | |
dc.type | Article de revue | |
dc.identifier.doi | 10.4028/www.scientific.net/MSF.534-536.1461 | |
dc.subject.hal | Chimie/Matériaux | |
bordeaux.journal | Materials Science Forum | |
bordeaux.page | 1461-1464 | |
bordeaux.volume | 534-536 | |
bordeaux.peerReviewed | oui | |
hal.identifier | hal-00122593 | |
hal.version | 1 | |
hal.popular | non | |
hal.audience | Internationale | |
hal.origin.link | https://hal.archives-ouvertes.fr//hal-00122593v1 | |
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