Interfacial and surface characterization of fluorine treated SnAgCu and NiTi powders and NiTi/SnAgCu composite materials
Language
en
Article de revue
This item was published in
Materials Science Forum. 2007, vol. 534-536, p. 1461-1464
Trans Tech Publications Inc.
English Abstract
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder in order to improve the mechanical performances of solder paste.
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder in order to improve the mechanical performances of solder paste.Read less <
English Keywords
Nickel
Titanium
Shape memory alloy
Fluorine treatment
Wetting property
Interface
Silver
Tin
Origin
Hal imported