Interfacial and surface characterization of fluorine treated SnAgCu and NiTi powders and NiTi/SnAgCu composite materials
Langue
en
Article de revue
Ce document a été publié dans
Materials Science Forum. 2007, vol. 534-536, p. 1461-1464
Trans Tech Publications Inc.
Résumé en anglais
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder in order to improve the mechanical performances of solder paste.
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder in order to improve the mechanical performances of solder paste.< Réduire
Mots clés en anglais
Nickel
Titanium
Shape memory alloy
Fluorine treatment
Wetting property
Interface
Silver
Tin
Origine
Importé de halUnités de recherche