Microstructural design of new high conductivity – high strength Cu-based alloy
Language
en
Article de revue
This item was published in
Journal of Alloys and Compounds. 2015, vol. 633, p. 42-47
Elsevier
English Abstract
Some novel high conductivity–high strength materials were designed in the binary Cu–Mg. They exhibit an excellent balance between strength and electrical properties. The properties and the performance of the designed ...Read more >
Some novel high conductivity–high strength materials were designed in the binary Cu–Mg. They exhibit an excellent balance between strength and electrical properties. The properties and the performance of the designed materials are compared with the main Cu-based alloys and the analysis shows that they perform equally to the best one (Cu–Be). Furthermore, we show that an increase of Mg content modifies the microstructure feature and leads to a strong increase of strength without any significant deterioration of the electrical conductivity. This behavior was attributed to the formation of eutectic islands in which high density of Cu2Mg nanoparticles precipitate.Read less <
English Keywords
Strength
Copper alloys
Electrical conductivity
Microstructure
ANR Project
Alliages Conducteurs à Haute Résistance Mécanique (New High Strength-High Conductivity Alloys) - ANR-08-JCJC-0133
Origin
Hal imported