GORSSE, Stéphane; OUVRARD, Blanche; GOUNÉ, Mohamed; POULON-QUINTIN, Angeline

doi:10.1016/j.jallcom.2015.01.234

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Licencia de uso del documento

http://creativecommons.org/licenses/by-nc-nd/

GORSSE, Stéphane
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

OUVRARD, Blanche
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

GOUNÉ, Mohamed
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

Idioma

Article de revue

Este ítem está publicado en

Journal of Alloys and Compounds. 2015, vol. 633, p. 42-47

Elsevier

Resumen en inglés

Some novel high conductivity–high strength materials were designed in the binary Cu–Mg. They exhibit an excellent balance between strength and electrical properties. The properties and the performance of the designed materials are compared with the main Cu-based alloys and the analysis shows that they perform equally to the best one (Cu–Be). Furthermore, we show that an increase of Mg content modifies the microstructure feature and leads to a strong increase of strength without any significant deterioration of the electrical conductivity. This behavior was attributed to the formation of eutectic islands in which high density of Cu2Mg nanoparticles precipitate.< Leer menos

Palabras clave en inglés

Strength

Copper alloys

Electrical conductivity

Microstructure

DOI

http://dx.doi.org/10.1016/j.jallcom.2015.01.234

Proyecto ANR

Alliages Conducteurs à Haute Résistance Mécanique (New High Strength-High Conductivity Alloys) - ANR-08-JCJC-0133

Orígen

Importado de Hal

Centros de investigación

Institut de Chimie de la Matière Condensée de Bordeaux (ICMCB) - UMR 5026