Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures
Language
en
Article de revue
This item was published in
International Journal of Extreme Manufacturing. 2019, vol. 1, n° 2, p. 025001
IOP Science
English Abstract
Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures ...Read more >
Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ~200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 S m−1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to ~105 S m−1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models. The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc.Read less <
English Keywords
joining
silver nanowires
nanofabrication
three dimensional
precise assembly
Origin
Hal imported