Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | LIU, Ying | |
| hal.structure.identifier | Wuhan National Laboratory for Optoelectronics | |
| dc.contributor.author | XIONG, Wei | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | WEI LI, Da | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | LU, Yao | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | HUANG, Xi | |
| hal.structure.identifier | Wuhan National Laboratory for Optoelectronics | |
| dc.contributor.author | LI, Huan | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | FAN, Li Sha | |
| hal.structure.identifier | School of Mechanical Engineering | |
| dc.contributor.author | JIANG, Lan | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | SILVAIN, Jean-François | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | LU, Yong Feng | |
| dc.date.issued | 2019 | |
| dc.identifier.issn | 2631-7990 | |
| dc.description.abstractEn | Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ~200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 S m−1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to ~105 S m−1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models. The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc. | |
| dc.language.iso | en | |
| dc.publisher | IOP Science | |
| dc.subject.en | joining | |
| dc.subject.en | silver nanowires | |
| dc.subject.en | nanofabrication | |
| dc.subject.en | three dimensional | |
| dc.subject.en | precise assembly | |
| dc.title.en | Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1088/2631-7990/ab17f7 | |
| dc.subject.hal | Chimie/Matériaux | |
| dc.subject.hal | Chimie/Polymères | |
| bordeaux.journal | International Journal of Extreme Manufacturing | |
| bordeaux.page | 025001 | |
| bordeaux.volume | 1 | |
| bordeaux.issue | 2 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-02141746 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-02141746v1 | |
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