LIU, Ying; XIONG, Wei; WEI LI, Da; LU, Yao; HUANG, Xi; LI, Huan; FAN, Li Sha; JIANG, Lan; SILVAIN, Jean-François; LU, Yong Feng

doi:10.1088/2631-7990/ab17f7

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LIU, Ying
Department of Electrical Engineering

XIONG, Wei
Wuhan National Laboratory for Optoelectronics

WEI LI, Da
Department of Electrical Engineering

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International Journal of Extreme Manufacturing. 2019, vol. 1, n° 2, p. 025001

IOP Science

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Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ~200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 S m−1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to ~105 S m−1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models. The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc.< Réduire

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joining

silver nanowires

nanofabrication

three dimensional

precise assembly

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Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures

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