Architectural optimisation for microelectronic packaging
Langue
en
Article de revue
Ce document a été publié dans
Applied Thermal Engineering. 2009-03-25, vol. 29, n° 11-12, p. 2391-2395
Elsevier
Résumé en anglais
The aim of this paper is to provide a methodical approach for architectural optimization of power microelectronic devices. Because critical parameters of electronic devices are linked with reliability, architectural ...Lire la suite >
The aim of this paper is to provide a methodical approach for architectural optimization of power microelectronic devices. Because critical parameters of electronic devices are linked with reliability, architectural optimisation, selection of the geometrical parameters of device and optimization of these parameters by iteration method associated by numerical analysis of reliability have to be achieved. In this way, this paper discusses about a methodical and numerical approach for the optimization of reliability in electronic devices, in particular the influence of geometrical parameters on the device reliability.< Réduire
Mots clés en anglais
Physical Sciences
Origine
Importé de halUnités de recherche