A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices
Language
EN
Article de revue
This item was published in
IEEE Transactions on Power Electronics. 2022-10, vol. 37, n° 10, p. 11511-11515
English Abstract
In this letter, an innovative technique is presented, which allows the experimental extraction of the junction-to-ambient thermal impedance (ZTH) of power devices operating in their application environment (in situ). The ...Read more >
In this letter, an innovative technique is presented, which allows the experimental extraction of the junction-to-ambient thermal impedance (ZTH) of power devices operating in their application environment (in situ). The technique draws inspiration from the thermal characterization of RF transistors, and is based on simple measurements of electrical signals, while not requiring a thermochuck, the calibration of a thermometer, as well as temperature sensors or IR cameras. The validation of the technique is unambiguously performed by applying the “simulated experiments” strategy on an SiC-based multichip power module.Read less <
English Keywords
Electrothermal (ET) simulation
finite-element method simulation
in-situ thermal characterization
power devices
thermal impedance (Z $_{\mathrm {TH}}$ ) measurement