A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices
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Article de revue
Este ítem está publicado en
IEEE Transactions on Power Electronics. 2022-10, vol. 37, n° 10, p. 11511-11515
Resumen en inglés
In this letter, an innovative technique is presented, which allows the experimental extraction of the junction-to-ambient thermal impedance (ZTH) of power devices operating in their application environment (in situ). The ...Leer más >
Palabras clave en inglés
Electrothermal (ET) simulation
finite-element method simulation
in-situ thermal characterization
power devices
thermal impedance (Z $_{\mathrm {TH}}$ ) measurement