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Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Workshop Correlative Materials Characterization, Workshop Correlative Materials Characterization, de, Dresde, 2022-10)Autre communication scientifique (congrès sans actes - poster - séminaire...) -
Moisture Diffusion Inside the BEOL of an FC-PBGA Package
(IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 12, n° 11, pp. 1740-1747, 2022-11)Article de revueLibre accès -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Satellite European School for Young Scientists Microscopy and Materials Characterization, Satellite European School for Young Scientists Microscopy and Materials Characterization, de, Dresde, 2022-10-12)Autre communication scientifique (congrès sans actes - poster - séminaire...)Libre accès -
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe
Communication dans un congrès -
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès -
Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack
Communication dans un congrès -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue