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Chemical sensor based on a novel capacitive microwave flexible transducer with polymer nanocomposite-carbon nanotube sensitive film
(Microsystem Technologies. vol. 28, pp. 1365-1378, 2022-06)Article de revue -
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
(Microelectronic Engineering. vol. 261, pp. 111809, 2022-05)Article de revue -
Screen-Printed Microcantilevers Coated with Functionalized Mesocellular Foam Silica for Detection of Solvent Vapors
(IEEE Sensors Journal. pp. 1-1, 2022-01-01)Article de revue -
Dynamics of the corrosion for SAC305 solder alloy in salt environment
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
2D Model for moisture diffusion in integrated Low-k dielectrics
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Extraction of small-signal equivalent circuit for de-embedding of 3D vertical nanowire transistor
(Solid-State Electronics. vol. 194, pp. 108359, 2022-08)Article de revue -
28-nm FD-SOI CMOS Submilliwatt Ring Oscillator-Based Dual-Loop Integer-N PLL for 2.4-GHz Internet-of-Things Applications
(IEEE Transactions on Microwave Theory and Techniques. vol. 70, n° 4, pp. 2207-2216, 2022-04)Article de revue -
Epoxy Mold Compound Characterization for Modeling Packaging Reliability
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Increased Breakdown Voltage and robustness of Embedded power module
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
A comprehensive analysis of AlN spacer and AlGaN n-doping effects on the 2DEG resistance in AlGaN/AlN/GaN heterostructures
(Solid-State Electronics. vol. 194, pp. 108322, 2022-08)Article de revue