Recherche
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Moisture Diffusion Inside the BEOL of an FC-PBGA Package
(IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 12, n° 11, pp. 1740-1747, 2022-11)Article de revueLibre accès -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe
Communication dans un congrès -
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès -
Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack
Communication dans un congrès -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue -
Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs
Communication dans un congrès -
Sliding-Mode Control for On-Orbit Rendezvous with a Fleeing Passive Target on a Circular Capture Trajectory
(2022 30th Mediterranean Conference on Control and Automation (MED), 30th IEEE Mediterranean Conference on Control and Automation, Jun 2022, Athens, Greece., gr, Athènes, 2022-08-01)Communication dans un congrès avec actes