Browsing IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 by subject "Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique"
Now showing items 1-20 of 37
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Applications de l acoustique picoseconde à l analyse non destructive de circuits intégrés
(Colloque Interdisciplinaire en Instrumentation (C2I), FR, 2004)Communication dans un congrès avec actes -
A 5G 65-nm PD-SOI CMOS 23.2-to-28.8 GHz Low-Jitter Quadrature-Coupled Injection-Locked Digitally-Controlled Oscillator
Communication dans un congrès -
Elaboration of a new pulsed laser system for SEE testing
Communication dans un congrès -
Thermal Modelling and Power Consumption Estimation of a Multi Floor Small Scale Building Using SPICE Simulator
(WSEAS Transactions on Environment and Development. vol. 18, pp. 315-321, 2022-02-09)Article de revueOpen access -
A New Approach in the Field of Hydrogen Gas Sensing Using MEMS Based 3C-SiC Microcantilevers
(13th European Conference on Silicon Carbide and Related Materials, ECSCRM 2020·2021, fr, Tours, 2022-05-31)Communication dans un congrès avec actesOpen access -
H2MEMS Project: Resonant MEMS for Detection of Hydrogen Release in Radioactive Waste Disposal Facility1
(H2MEMS Project: Resonant MEMS for detection of hydrogen release in radioactive waste disposal facility, 2022 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS), fr, Paris, 2022-04)Communication dans un congrès avec actesOpen access -
Chemical sensor based on a novel capacitive microwave flexible transducer with polymer nanocomposite-carbon nanotube sensitive film
(Microsystem Technologies. vol. 28, pp. 1365-1378, 2022-06)Article de revue -
A 40 GHz Varactor-less Class-C VCO with 17.1% Tuning Range and Long-Term Reliability in 28nm FD-SOI for Satellite Communications
Communication dans un congrès -
Vertical Organic Electrochemical Transistors and Electronics for Low Amplitude Micro‐Organ Signals
(Advanced Science. vol. 9, n° 8, pp. 2105211, 2022-01)Article de revueOpen access -
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
(Microelectronic Engineering. vol. 261, pp. 111809, 2022-05)Article de revue -
Screen-Printed Microcantilevers Coated with Functionalized Mesocellular Foam Silica for Detection of Solvent Vapors
(IEEE Sensors Journal. pp. 1-1, 2022-01-01)Article de revue -
Dynamics of the corrosion for SAC305 solder alloy in salt environment
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
2D Model for moisture diffusion in integrated Low-k dielectrics
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Extraction of small-signal equivalent circuit for de-embedding of 3D vertical nanowire transistor
(Solid-State Electronics. vol. 194, pp. 108359, 2022-08)Article de revue -
Frequency Identification of a Memory Polynomial Model for PA Modeling
(2022 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), I2MTC 2022, ca, Ottawa, 2022-05-16)Communication dans un congrès avec actesOpen access -
28-nm FD-SOI CMOS Submilliwatt Ring Oscillator-Based Dual-Loop Integer-N PLL for 2.4-GHz Internet-of-Things Applications
(IEEE Transactions on Microwave Theory and Techniques. vol. 70, n° 4, pp. 2207-2216, 2022-04)Article de revue -
Fractional Behaviours Modelling with Volterra Equations: Application to a Lithium-Ion Cell and Comparison with a Fractional Model
(Fractal and Fractional. vol. 6, n° 3, pp. 137, 2022-03)Article de revueOpen access -
Epoxy Mold Compound Characterization for Modeling Packaging Reliability
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Increased Breakdown Voltage and robustness of Embedded power module
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
A comprehensive analysis of AlN spacer and AlGaN n-doping effects on the 2DEG resistance in AlGaN/AlN/GaN heterostructures
(Solid-State Electronics. vol. 194, pp. 108322, 2022-08)Article de revue