A Simple Process for the Fabrication of Parallel-Plate Electrostatic MEMS Resonators by Gold Thermocompression Bonding

Abstract

The present work introduces a simple and quick process for the fabrication of flexural MEMS resonators with electrostatic actuation and capacitive detection. Gold thermocompression is used to anchor the free-standing structure, to provide electrical connections and to seal the chip to protect the structure to be released during wet etching, in a single step. The additional advantage of this process is the ability to simply adjust the gap of the parallel-plate capacitor through the thickness of electroplated gold. Squeeze damping is reduced by fabricating devices with increasing gaps.