Dataset of mechanical properties and electrical conductivity of copper-based alloys
LIN, Wei-Chih
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
National Tsing Hua University [Hsinchu] [NTHU]
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Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
National Tsing Hua University [Hsinchu] [NTHU]
LIN, Wei-Chih
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
National Tsing Hua University [Hsinchu] [NTHU]
< Reduce
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
National Tsing Hua University [Hsinchu] [NTHU]
Language
en
Article de revue
This item was published in
Scientific Data. 2023, vol. 10, p. 504
Nature Publishing Group
English Abstract
This article presents a collection of data on approximately 150 copper-based alloys. The data compilation is based on articles published since 1993 and consists of about 1830 records. Each record contains a unique set of ...Read more >
This article presents a collection of data on approximately 150 copper-based alloys. The data compilation is based on articles published since 1993 and consists of about 1830 records. Each record contains a unique set of descriptors, such as composition and processing route, and targets, including properties such as hardness, yield strength, ultimate tensile strength, and electrical conductivity. The dataset includes information on the composition in mass percent of 20 alloying elements, and hundreds of temperature-time thermal treatments and thermomechanical conditions. The database is continually updated and hosted on an open data repository. Some of the data are presented graphically in the article to aid interpretation. This study intends to promote the identification of more sustainable alternatives to Cu-Be alloys, which is particularly relevant in developing non-toxic and environmentally-friendly alloys.Read less <
Origin
Hal imported