Thermal parameters identification of micrometric layers of microelectronic devices by thermoreflectance microscopy
Language
en
Article de revue
This item was published in
Microelectronics Journal. 2004-10, vol. 35, n° 10, p. 811-816
Elsevier
English Abstract
The objective of this paper is the determination of the thermal properties of micrometric layers of electronic devices using a thermoreflectance probe. Unlike classical thermoreflectance methods, the main point of the ...Read more >
The objective of this paper is the determination of the thermal properties of micrometric layers of electronic devices using a thermoreflectance probe. Unlike classical thermoreflectance methods, the main point of the method presented in this paper is to be able to quantify the heating energy (by Joule effect) and the effective temperature response (by calibration). It is then possible to estimate the thermal conductivity (in W m−1 K−1) instead of the thermal diffusivity (in m2 s−1). A semi-analytical thermal 3D-periodic model then enables to identify a few thermal properties of the layers of the device, and in particular the thermal conductivity of the passivation layer. This methodology has been applied to the study of an industrial device containing interconnect test structures made of copper lines on a silicon wafer with a few micrometers BCB (BenzoCycloButene) polymer passivation layer. The BCB thermal conductivity and the metal heat capacity are obtained using this method.Read less <
English Keywords
Thermoreflectance
Calibration
Thermal parameters identification
Thermal conductivity
Microelectronic devices
Laser probing
Origin
Hal imported