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hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorGORSSE, Stéphane
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorOUVRARD, Blanche
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorGOUNÉ, Mohamed
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorPOULON-QUINTIN, Angeline
dc.date.issued2015
dc.identifier.issn0925-8388
dc.description.abstractEnSome novel high conductivity–high strength materials were designed in the binary Cu–Mg. They exhibit an excellent balance between strength and electrical properties. The properties and the performance of the designed materials are compared with the main Cu-based alloys and the analysis shows that they perform equally to the best one (Cu–Be). Furthermore, we show that an increase of Mg content modifies the microstructure feature and leads to a strong increase of strength without any significant deterioration of the electrical conductivity. This behavior was attributed to the formation of eutectic islands in which high density of Cu2Mg nanoparticles precipitate.
dc.description.sponsorshipAlliages Conducteurs à Haute Résistance Mécanique (New High Strength-High Conductivity Alloys) - ANR-08-JCJC-0133
dc.language.isoen
dc.publisherElsevier
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/
dc.subject.enStrength
dc.subject.enCopper alloys
dc.subject.enElectrical conductivity
dc.subject.enMicrostructure
dc.title.enMicrostructural design of new high conductivity – high strength Cu-based alloy
dc.typeArticle de revue
dc.identifier.doi10.1016/j.jallcom.2015.01.234
dc.subject.halChimie/Matériaux
bordeaux.journalJournal of Alloys and Compounds
bordeaux.page42-47
bordeaux.volume633
bordeaux.peerReviewedoui
hal.identifierhal-01122713
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01122713v1
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