GORSSE, Stéphane; OUVRARD, Blanche; GOUNÉ, Mohamed; POULON-QUINTIN, Angeline

doi:10.1016/j.jallcom.2015.01.234

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http://creativecommons.org/licenses/by-nc-nd/

GORSSE, Stéphane
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

OUVRARD, Blanche
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

GOUNÉ, Mohamed
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

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Article de revue

Ce document a été publié dans

Journal of Alloys and Compounds. 2015, vol. 633, p. 42-47

Elsevier

Résumé en anglais

Some novel high conductivity–high strength materials were designed in the binary Cu–Mg. They exhibit an excellent balance between strength and electrical properties. The properties and the performance of the designed materials are compared with the main Cu-based alloys and the analysis shows that they perform equally to the best one (Cu–Be). Furthermore, we show that an increase of Mg content modifies the microstructure feature and leads to a strong increase of strength without any significant deterioration of the electrical conductivity. This behavior was attributed to the formation of eutectic islands in which high density of Cu2Mg nanoparticles precipitate.< Réduire

Mots clés en anglais

Strength

Copper alloys

Electrical conductivity

Microstructure

DOI

http://dx.doi.org/10.1016/j.jallcom.2015.01.234

Project ANR

Alliages Conducteurs à Haute Résistance Mécanique (New High Strength-High Conductivity Alloys) - ANR-08-JCJC-0133

Origine

Importé de hal

Unités de recherche

Institut de Chimie de la Matière Condensée de Bordeaux (ICMCB) - UMR 5026