Additive manufacturing of copper/diamond composites for thermal management applications
CONSTANTIN, Loïc
University of Nebraska–Lincoln
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
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University of Nebraska–Lincoln
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
CONSTANTIN, Loïc
University of Nebraska–Lincoln
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
< Reduce
University of Nebraska–Lincoln
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Language
en
Article de revue
This item was published in
Manufacturing Letters. 2020-04, vol. 24, p. 61-66
Elsevier
English Abstract
Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to ...Read more >
Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.Read less <
English Keywords
Additive manufacturing
composites
copper
diamond
interphase
Origin
Hal imported