KUSIAK, A.; BATTAGLIA, Jean-Luc; GOMEZ, Sonia; MANAUD, Jean-Pierre; LE PETITCORPS, Yann

doi:10.1051/epjap:2006064

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KUSIAK, A.
Transferts, écoulements, fluides, énergétique [TREFLE]

BATTAGLIA, Jean-Luc
Transferts, écoulements, fluides, énergétique [TREFLE]

GOMEZ, Sonia
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

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European Physical Journal: Applied Physics. 2006, vol. 35, n° 1, p. 17-27

EDP Sciences

Résumé en anglais

The thermal conductivity and the interface thermal contact resistance of four different in thickness CuO films, obtained by PVD on a tungsten carbide substrate were investigated with a developed modulated photothermal method based on infrared measurement. According to the knowledge of the substrate thermophysical properties, the gain between the thermal perturbation and the response of the sample was used as the experimental data. The results show the dependence of the effective longitudinal thermal conductivity on the film thickness. Scanning electron microscopy observations reveal the strong anisotropy and columnar structure of the deposits. Moreover, the chemical composition of films was tested. A similar composition for each film was also verified.< Réduire

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Experimental study

Physical vapor deposition

Contact resistance

Thermal contacts

Thin films

Interface properties

Copper oxides

Thermal conductivity

Thermal properties

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CuO thin films thermal conductivity and interfacial thermal resistance estimation

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