CuO thin films thermal conductivity and interfacial thermal resistance estimation
Idioma
en
Article de revue
Este ítem está publicado en
European Physical Journal: Applied Physics. 2006, vol. 35, n° 1, p. 17-27
EDP Sciences
Resumen en inglés
The thermal conductivity and the interface thermal contact resistance of four different in thickness CuO films, obtained by PVD on a tungsten carbide substrate were investigated with a developed modulated photothermal ...Leer más >
The thermal conductivity and the interface thermal contact resistance of four different in thickness CuO films, obtained by PVD on a tungsten carbide substrate were investigated with a developed modulated photothermal method based on infrared measurement. According to the knowledge of the substrate thermophysical properties, the gain between the thermal perturbation and the response of the sample was used as the experimental data. The results show the dependence of the effective longitudinal thermal conductivity on the film thickness. Scanning electron microscopy observations reveal the strong anisotropy and columnar structure of the deposits. Moreover, the chemical composition of films was tested. A similar composition for each film was also verified.< Leer menos
Palabras clave en inglés
Experimental study
Physical vapor deposition
Contact resistance
Thermal contacts
Thin films
Interface properties
Copper oxides
Thermal conductivity
Thermal properties
Orígen
Importado de HalCentros de investigación