CuO thin films thermal conductivity and interfacial thermal resistance estimation
| hal.structure.identifier | Transferts, écoulements, fluides, énergétique [TREFLE] | |
| dc.contributor.author | KUSIAK, A. | |
| hal.structure.identifier | Transferts, écoulements, fluides, énergétique [TREFLE] | |
| dc.contributor.author | BATTAGLIA, Jean-Luc | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | GOMEZ, Sonia | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | MANAUD, Jean-Pierre | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | LE PETITCORPS, Yann | |
| dc.date.issued | 2006 | |
| dc.identifier.issn | 1286-0042 | |
| dc.description.abstractEn | The thermal conductivity and the interface thermal contact resistance of four different in thickness CuO films, obtained by PVD on a tungsten carbide substrate were investigated with a developed modulated photothermal method based on infrared measurement. According to the knowledge of the substrate thermophysical properties, the gain between the thermal perturbation and the response of the sample was used as the experimental data. The results show the dependence of the effective longitudinal thermal conductivity on the film thickness. Scanning electron microscopy observations reveal the strong anisotropy and columnar structure of the deposits. Moreover, the chemical composition of films was tested. A similar composition for each film was also verified. | |
| dc.language.iso | en | |
| dc.publisher | EDP Sciences | |
| dc.subject.en | Experimental study | |
| dc.subject.en | Physical vapor deposition | |
| dc.subject.en | Contact resistance | |
| dc.subject.en | Thermal contacts | |
| dc.subject.en | Thin films | |
| dc.subject.en | Interface properties | |
| dc.subject.en | Copper oxides | |
| dc.subject.en | Thermal conductivity | |
| dc.subject.en | Thermal properties | |
| dc.title.en | CuO thin films thermal conductivity and interfacial thermal resistance estimation | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1051/epjap:2006064 | |
| dc.subject.hal | Chimie/Matériaux | |
| bordeaux.journal | European Physical Journal: Applied Physics | |
| bordeaux.page | 17-27 | |
| bordeaux.volume | 35 | |
| bordeaux.issue | 1 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-00326987 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-00326987v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=European%20Physical%20Journal:%20Applied%20Physics&rft.date=2006&rft.volume=35&rft.issue=1&rft.spage=17-27&rft.epage=17-27&rft.eissn=1286-0042&rft.issn=1286-0042&rft.au=KUSIAK,%20A.&BATTAGLIA,%20Jean-Luc&GOMEZ,%20Sonia&MANAUD,%20Jean-Pierre&LE%20PETITCORPS,%20Yann&rft.genre=article |
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