Recherche
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2D Model for moisture diffusion in integrated Low-k dielectrics
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Extraction of small-signal equivalent circuit for de-embedding of 3D vertical nanowire transistor
(Solid-State Electronics. vol. 194, pp. 108359, 2022-08)Article de revue -
Parameter identification and state estimation for a diabetic glucose‐insulin model via an adaptive observer
(International Journal of Robust and Nonlinear Control, 2022-01)Article de revue -
Development of a Transport Model Dedicated to an Agent-Based Simulation of Land Use
(Springer Nature Singapore, 2022-01)Chapitre d'ouvrage -
Two cetacean species reveal different long-term trends for toxic trace elements in European Atlantic French waters
(Chemosphere. vol. 294, n° 1, pp. 133676, 2022-05)Article de revue -
Couplage de FMI et HLA pour lngénierie de Systèmes
(JFMS 2020, JFMS 2020, Carges, 2020-11)Communication dans un congrès avec actes -
Visual Workflow Process Modeling and Simulation Approach Based on Non-Functional Properties of Resources
(Applied Sciences. vol. 10, n° 13, pp. 4664, 2020)Article de revue -
Selective sublimation of GaN and regrowth of AlGaN to co-integrate enhancement mode and depletion mode high electron mobility transistors
(Journal of Crystal Growth. vol. 593, pp. 126779, 2022-09-01)Article de revue -
60 GHz SIW Filter with 1.7 dB of Insertion Loss and 7 ps Added Jitter on OOK Modulated Signal
(2022 IEEE Radio and Wireless Symposium (RWS), Radio and Wireless Symposium (RWS), us, Las Vegas, 2022)Communication dans un congrès avec actes -
28-nm FD-SOI CMOS Submilliwatt Ring Oscillator-Based Dual-Loop Integer-N PLL for 2.4-GHz Internet-of-Things Applications
(IEEE Transactions on Microwave Theory and Techniques. vol. 70, n° 4, pp. 2207-2216, 2022-04)Article de revue