Recherche
-
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès -
Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack
Communication dans un congrès -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue -
Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs
Communication dans un congrès -
Sliding-Mode Control for On-Orbit Rendezvous with a Fleeing Passive Target on a Circular Capture Trajectory
(2022 30th Mediterranean Conference on Control and Automation (MED), 30th IEEE Mediterranean Conference on Control and Automation, Jun 2022, Athens, Greece., gr, Athènes, 2022-08-01)Communication dans un congrès avec actes -
Volterra equations for fractional behaviors modeling with application to lithium-ion cells
(2022 American Control Conference (ACC), 2022 American Control Conference (ACC), Atlanta, GA, USA, 2022, us, Atlanta, 2022-09-05)Communication dans un congrès avec actes -
AFSIW Y-junction Circulator for High-power Handling New Space Applications
(2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, Denver, CO, USA, 2022, us, Denver, 2022-08-29)Communication dans un congrès avec actes -
A New Modeling Framework For Cyber-Physical And Human Systems
(2022 Annual Modeling and Simulation Conference (ANNSIM), 2022 Annual Modeling and Simulation Conference (ANNSIM), San Diego, CA, USA, 2022, us, San Diego, 2022-08-23)Communication dans un congrès avec actes