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Increased Breakdown Voltage and robustness of Embedded power module
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
A comprehensive analysis of AlN spacer and AlGaN n-doping effects on the 2DEG resistance in AlGaN/AlN/GaN heterostructures
(Solid-State Electronics. vol. 194, pp. 108322, 2022-08)Article de revue -
Strong Piezoelectricity in 3R‐MoS 2 Flakes
(Advanced Electronic Materials. pp. 2101131, 2022-02)Article de revue -
Low Consumption Balanced Front-end Amplifiers Robust to Load Variations in 65nm PD-SOI CMOS Technology for 60 GHz Shortrange Wireless Applications
(IEEE Transactions on Circuits and Systems II: Express Briefs. pp. 1-1, 2022-01-01)Article de revue -
TRL-calibration Standards with Emphasis on Crosstalk Reduction
(14th Global Symposium on Millimeter-Waves and Terahertz, GSMM 2022, kr, Seoul, 2022-05-18)Communication dans un congrès avec actes -
A 25-50 GHz Digitally Controlled Phase-Shifter
(EuMIC 2021 - 2021 16th European Microwave Integrated Circuits Conference, 16th European Microwave Integrated Circuits Conference, EuMIC 2021, gb, Londres, 2022-04-03)Communication dans un congrès avec actes -
Signal-piloted processing metaheuristic optimization and wavelet decomposition based elucidation of arrhythmia for mobile healthcare
(Biocybernetics and Biomedical Engineering. vol. 42, n° 2, pp. 681-694, 2022-04)Article de revue -
Gas discrimination by simultaneous sound velocity and attenuation measurements using uncoated capacitive micromachined ultrasonic transducers
(Scientific Reports. vol. 12, n° 1, 2022-01-14)Article de revueOpen access -
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes -
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes