NAFFAKH, Mohammed; DUMON, Michel; DUPUY, Jerome; GÉRARD, Jean-François

doi:10.1002/app.21495

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NAFFAKH, Mohammed
Ingénierie des Matériaux Polymères - Laboratoire des Matériaux Macromoléculaires [IMP-LMM]

DUMON, Michel

Ingénierie des Matériaux Polymères - Laboratoire des Matériaux Macromoléculaires [IMP-LMM]
Team 1 LCPO : Polymerization Catalyses & Engineering

DUPUY, Jerome
Ingénierie des Matériaux Polymères - Laboratoire des Matériaux Macromoléculaires [IMP-LMM]

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Journal of Applied Polymer Science. 2005, vol. 96, n° 3, p. 660-672

Wiley

Résumé en anglais

The cure kinetics and mechanisms of an epoxy oligomer based on diglycidyl ether of bisphenol A (DGEBA), polymerized with a liquid aromatic diamine based on diethyl toluene diamine (DETDA 80), and its blends with poly(ether imide) (PEI) at concentrations of 0-15 wt % were studied with differential scanning calorimetry under dynamic and isothermal conditions. The kinetic analyses were performed with a phenomenological approach. The reaction mechanism of the blends remained the same as that of the neat epoxy. However, the addition of PEI had a marked effect on the cure kinetics in the DGEBA/ DETDA 80 system. The rate of reaction decreased with an increase in the thermoplastic content. Diffusion control was incorporated to describe the cure behavior of the blends in the latter stages. Greater diffusion control was observed as the PEI concentration increased and the cure temperature decreased. Polymer blends based on this epoxy/liquid aromatic diamine had not been previously studied from a kinetic viewpoint.< Réduire

Mots clés en anglais

curing

differential scanning calorimetry (DSC)

kinetics

modeling

blends

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Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

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