LE BIHAN, Soazig; DUBOIS, Tristan; BEGUERET, Jean Baptiste; EL ABBAZI, Adil

doi:10.1109/emccompo61192.2024.10742040

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LE BIHAN, Soazig
Laboratoire de l'intégration, du matériau au système [IMS]
Thales AVS France SAS

DUBOIS, Tristan

Laboratoire de l'intégration, du matériau au système [IMS]

BEGUERET, Jean Baptiste

Laboratoire de l'intégration, du matériau au système [IMS]

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2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2024-10-07, Torino. 2024-11-06p. 74-79

IEEE

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Introducing a new high-speed design requires a careful optimization of any discontinuities that may degrade signal quality. A high-speed signal includes structures such as BGA (Ball Grid Array), vias, AC coupling capacitors, or connectors. Poorly matched impedance may result in undesirable signal reflections, energy losses, and electromagnetic interference. These structures need to be wisely optimized in order to limit signal reflections along the path while taking into account manufacturing constraints, costs, performance and routing density for avionics products. However, with each new design change during the various stages of development, major modifications can challenge previous optimization choices. Therefore, it is crucial to create adaptive and flexible models that can easily evolve with these changes. The objective is to develop a library of optimized models that can be seamlessly integrated into internal routing tools and efficiently reused for future designs. Three types of mathematical algorithms were studied based on the objectives, constraints, performance, and time required to converge toward the best design in order to automate this time-consuming process.< Réduire

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Enhancing High-Speed Ethernet Link Design at 25 Gbps in Aerospace Environments Through Optimization Algorithms

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