Laser probe measurements of quality evolution of solder joints during thermal cycling ageing tests
Langue
en
Article de revue
Ce document a été publié dans
Quality and Reliability Engineering International. 1996-11, vol. 12, n° 6, p. 447-452
Wiley
Résumé en anglais
We present the results of a non‐destructive measuring method allowing us to characterize the evolution of solder joints during thermal cycling ageing tests. The method uses a high resolution optical probe to detect selectively ...Lire la suite >