A Heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits
Langue
en
Article de revue
Ce document a été publié dans
Measurement Science and Technology. 2008-09-22, vol. 19, n° 11, p. 115704 (1-8)
IOP Publishing
Résumé en anglais
The observation of spectral components of the power dissipated by devices and circuits in integrated circuits (IC) by temperature measurements is limited by the bandwidth of either the temperature transducer or the intrinsic ...Lire la suite >
The observation of spectral components of the power dissipated by devices and circuits in integrated circuits (IC) by temperature measurements is limited by the bandwidth of either the temperature transducer or the intrinsic cut-off frequency provided by the thermal coupling inside the chip. In this paper, we use a heterodyne method to observe the high-frequency behavior of circuits and devices by means of low-frequency lock-in temperature measurements. As experimental results, two applications of the technique are presented: detection of hot spots in ICs activated by high-frequency electrical signals and the observation of the frequency response of an integrated resistor through temperature measurements. The heterodyne method has been used in this paper with four different measurement techniques: embedded differential BiCMOS temperature sensor, laser reflectometer, laser interferometer and internal IR laser deflection meter.< Réduire
Mots clés en anglais
temperature measurements
integrated circuits
high-frequency measurements
thermal testing
Origine
Importé de halUnités de recherche