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A Heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits

hal.structure.identifierElectronic Engineering Department
dc.contributor.authorALTET, Josep
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorALDRETE-VIDRIO, Eduardo
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorMATEO, Diego
hal.structure.identifierCentro Nacional de Microelectronica [Spain] [CNM]
dc.contributor.authorPERPIÑÀ, Xavier
hal.structure.identifierCentro Nacional de Microelectronica [Spain] [CNM]
dc.contributor.authorJORDÀ, Xavier
hal.structure.identifierCentro Nacional de Microelectronica [Spain] [CNM]
dc.contributor.authorVELLVEHI, Miquel
hal.structure.identifierCentro Nacional de Microelectronica [Spain] [CNM]
dc.contributor.authorMILLÁN, José
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorSALHI, Amine
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorGRAUBY, Stéphane
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorCLAEYS, Wilfrid
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, Stefan
dc.date.created2008-03-26
dc.date.issued2008-09-22
dc.identifier.issn0957-0233
dc.description.abstractEnThe observation of spectral components of the power dissipated by devices and circuits in integrated circuits (IC) by temperature measurements is limited by the bandwidth of either the temperature transducer or the intrinsic cut-off frequency provided by the thermal coupling inside the chip. In this paper, we use a heterodyne method to observe the high-frequency behavior of circuits and devices by means of low-frequency lock-in temperature measurements. As experimental results, two applications of the technique are presented: detection of hot spots in ICs activated by high-frequency electrical signals and the observation of the frequency response of an integrated resistor through temperature measurements. The heterodyne method has been used in this paper with four different measurement techniques: embedded differential BiCMOS temperature sensor, laser reflectometer, laser interferometer and internal IR laser deflection meter.
dc.language.isoen
dc.publisherIOP Publishing
dc.subject.entemperature measurements
dc.subject.enintegrated circuits
dc.subject.enhigh-frequency measurements
dc.subject.enthermal testing
dc.title.enA Heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits
dc.typeArticle de revue
dc.identifier.doi10.1088/0957-0233/18/11/115704
bordeaux.journalMeasurement Science and Technology
bordeaux.page115704 (1-8)
bordeaux.volume19
bordeaux.issue11
bordeaux.peerReviewedoui
hal.identifierhal-00719197
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00719197v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Measurement%20Science%20and%20Technology&rft.date=2008-09-22&rft.volume=19&rft.issue=11&rft.spage=115704%20(1-8)&rft.epage=115704%20(1-8)&rft.eissn=0957-0233&rft.issn=0957-0233&rft.au=ALTET,%20Josep&ALDRETE-VIDRIO,%20Eduardo&MATEO,%20Diego&PERPI%C3%91%C3%80,%20Xavier&JORD%C3%80,%20Xavier&rft.genre=article


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