Microstructural evolution and mechanical properties of SnAgCu alloys
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | FOUASSIER, Olivier | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | HEINTZ, Jean-Marc | |
| hal.structure.identifier | THALES Airborne Systems [Elancourt] | |
| dc.contributor.author | CHAZELAS, J. | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | GEFFROY, Pierre-Marie | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | SILVAIN, Jean-François | |
| dc.date.issued | 2006 | |
| dc.identifier.issn | 0021-8979 | |
| dc.description.abstractEn | Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from –50 to +150 °C, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations. | |
| dc.language.iso | en | |
| dc.publisher | American Institute of Physics | |
| dc.subject.en | SnAgCu alloys | |
| dc.subject.en | Mechanical properties | |
| dc.subject.en | Heat and thermomechanical treatments | |
| dc.subject.en | Deformation | |
| dc.subject.en | plasticity | |
| dc.subject.en | and creep | |
| dc.title.en | Microstructural evolution and mechanical properties of SnAgCu alloys | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1063/1.2244478 | |
| dc.subject.hal | Chimie/Matériaux | |
| dc.subject.hal | Physique [physics]/Matière Condensée [cond-mat]/Science des matériaux [cond-mat.mtrl-sci] | |
| bordeaux.journal | Journal of Applied Physics | |
| bordeaux.page | 043519 | |
| bordeaux.volume | 100 | |
| bordeaux.issue | 4 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-00111081 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Non spécifiée | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-00111081v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Journal%20of%20Applied%20Physics&rft.date=2006&rft.volume=100&rft.issue=4&rft.spage=043519&rft.epage=043519&rft.eissn=0021-8979&rft.issn=0021-8979&rft.au=FOUASSIER,%20Olivier&HEINTZ,%20Jean-Marc&CHAZELAS,%20J.&GEFFROY,%20Pierre-Marie&SILVAIN,%20Jean-Fran%C3%A7ois&rft.genre=article |
Fichier(s) constituant ce document
| Fichiers | Taille | Format | Vue |
|---|---|---|---|
|
Il n'y a pas de fichiers associés à ce document. |
|||